International collaboration EU and Japan on semiconductors
Cyfrowa Europa · Temat konkursu
Podsumowanie
Polska firma może skorzystać z tego naboru na B+R.
Funds EU–Japan collaboration demonstrating semiconductor packaging, photonics and chiplet interoperability in laboratory and pilot manufacturing environments; applicant types are unspecified.
- Kto może złożyć wniosek
- Źródło nie przesądza.
- Kwota
- 3 mln € – 5 mln € na projektBudżet całkowity 5 000 000 €
- Termin
- 08.12.2026 01:00 CETza 45 dni
- Status
- Otwartyotwarty 7 lip 2026
Ocena maszynowa na podstawie tekstu naboru; warunki sprawdź u źródła.
Opis
Expected Outcome:
Projects are expected to contribute to the following expected outcomes:
• Advanced heterogeneous integration, particularly in 2.5D and 3D packaging and integrated photonics, to support AI functionalities.
• Standardised chiplet interfaces, enabling interoperability and fostering a dynamic chiplet ecosystem
Expected outcomes should have direct and immediate impact on European industry.
Furthermore, proposed projects should demonstrate solutions across laboratory and pilot environments, with verification in semiconductor manufacturing use cases. The centre of gravity of envisaged work should address Technology Readiness Levels 5-7. Proposals also need to facilitate knowledge transfer and promote stakeholder engagement through industry workshops, publications, and networking events.
Kto może złożyć wniosek – szczegóły
- Cel
- Badania i innowacje
- Znaczenie dla B+R
- 3 z 3
- Polska kwalifikuje się
- Tak
- Ograniczenie krajów
- EU–Japan collaboration; involvement of Japanese counterparts is required.
- Region
- Dowolny
- Konsorcjum
- Niejasne
- Poziom gotowości (TRL)
- 5-7
- Tematy
- Semiconductor chiplets
- Heterogeneous integration
- 2.5D and 3D packaging
- Integrated photonics
- AI hardware
Ocena maszynowa na podstawie tekstu naboru; warunki sprawdź u źródła. 23 paź 2026
Warunki
Fakty wyodrębnione z dokumentów źródłowych w przeglądzie danych Scindu. Każda wartość ma własne warunki. Brak danych oznacza, że źródło nie podaje wartości, a nie zero ani brak limitu.
- Nabór zamknięty
- Nie
- Konsorcjum wymagane
- Tak
At least three independent legal entities must participate as beneficiaries; affiliated entities do not count toward this minimum.
- Zakres projektu
- The topic supports an EU–Japan chiplet ecosystem for heterogeneous integration in the AI stack, including 2.5D/3D packaging, integrated photonics and chiplet co-optimization; work should demonstrate across laboratory/pilot settings with semiconductor manufacturing use cases, with expected centre of gravity at TRL 5–7.
- Inny warunek
- The official Part B template asks applicants to list staff included in the project budget (budget category A) by function/profile and briefly describe their tasks. This is an application-planning prompt, not a call-specific headcount or hiring entitlement.
- Inny warunek
- The current official Chips JU call page and Appendix 8 show a deadline of 8 December 2026 at 17:00 Brussels time. The retained Guide for Applicants still states 24 September 2026 at 17:00, which conflicts with the newer current call page and Appendix 8; use the current 8 December date provisionally and confirm against the live submission system before filing.
- Inny warunek
- Topic scope names materials scientists, chemical engineers and AI experts among the expertise to engage; it also mentions semiconductor manufacturers as an organisational stakeholder. These scope references do not establish required employee hires.
- Wymóg partnerstwa
- Proposers are expected to work closely with Japanese organisations and must describe how they involve Japanese counterparts and the activities on which they collaborate. A comparable commitment is expected from Japanese organisations.
Kwoty i koszty
- Budżet orientacyjny
- 5 000 000 €
Budżet tematu z tabeli budżetowej portalu. Limity na projekt i ryczałty są w warunkach konkursu.
- Alokacja naboru
- 5 000 000 €
Indicative EU-side call budget; not an individual project award or entitlement.
- Intensywność wsparcia, maksimum
- 50
Maximum EU reimbursement share of eligible costs for for-profit organisations; beneficiaries may ask for a lower contribution.
- Intensywność wsparcia, maksimum
- 50
Maximum EU reimbursement share of eligible costs for University/Other not-for-profit entities; beneficiaries may ask for a lower contribution.
- Intensywność wsparcia, maksimum
- 50
Maximum EU reimbursement share of eligible costs for for-profit SMEs; beneficiaries may ask for a lower contribution.
- Oczekiwane dofinansowanie projektu, do
- 5 000 000 €
Expected contribution range only; different amounts may be submitted and selected, so not an individual entitlement or hard cap.
- Oczekiwane dofinansowanie projektu, od
- 3 000 000 €
Expected contribution range only; different amounts may be submitted and selected, so not an individual entitlement or hard cap.
Personel i usługi
Personel techniczny
Tylko przykład
The topic scope identifies this expertise to be engaged, but does not require an employment relationship or a specific role in the consortium. This illustrative profile does not assert a hire, headcount, qualification threshold, FTE, duration, rate or salary.
Dokumenty źródłowe
Dane naboru
- Otwarcie
- 7 lip 2026
- Tryb terminów
- Single-stage
- Program
- Cyfrowa Europa · 2021 - 2027
- Konkurs
- DIGITAL-JU-CHIPS-2026-SG-JAPAN · DIGITAL-JU-CHIPS-2026-SG-JAPAN
- Rodzaje działań
- DIGITAL JU Simple Grants
- Źródło
- ec.europa.eu
- Sprawdzono
- 23 paź 2026
- Aktualizacja portalu
- 23 wrz 2026
- Status przeglądu
- Przegląd częściowy
- Przejrzano
- 23 paź 2026
To skrót ze strony źródłowej, nie tekst urzędowy. Kwalifikowalność, warunki i system składania wniosków są u źródła.